STMicroelectronics and Qualcomm have agreed to integrate Qualcomm’s Wi-Fi, Bluetooth and Thread wireless IC, which it describes as ‘AI-powered’, into STM32 development tools. Beyond this, ST said that it plans to ...
The post ST and Qualcomm team up for intelligent Wi-Fi, Bluetooth and Thread modules appeared first on Electronics Weekly.
BrainChip has created <1mW neural processing core intellectual property for speech, audio and vital signs analysis. Called Akida Pico and described as event-based co-processor, it is intended for “voice wake ...
The post <1mW neural processor IP for speech-based wake-up appeared first on Electronics Weekly.
XP Power has released two baseplate-cooled dc-dc converter series with 14 to 160Vdc (12:1) inputs. Nominally running from 72V rails, they are rated at 150W (RDF150 series) or 200W (RDF200 ...
The post 200W dc-dc converter with 12:1 input range appeared first on Electronics Weekly.
Sascha Kunzmann has become the president of Alps Alpine Europe, succeeding Wilfried Baumann who will remain as corporate v-p of Japanese parent company Alps Alpine Co, and continue to oversee ...
The post Change at the top of Alps Alpine Europe appeared first on Electronics Weekly.
Pico Technology has added 16 digital channels to its 500MHz 3418E display-less USB oscilloscope, creating a model named ‘3418E MSO’. “MSO models offer engineers the ability to simultaneously capture and ...
The post PicoTech adds digital channels to 500MHz USB scope appeared first on Electronics Weekly.
Semiconductor photomask supplier, Toppan Photomask will change its name to Tekscend Photomask, from 01 November. The new name is a combination of technology and ascend, said the company’s press release, ...
The post Toppan Photomask rebrands as Tekscend appeared first on Electronics Weekly.
UKRI has announced the 16 semiconductor projects sharing £11.5 million to scale up semiconductor manufacturing, improve supply chain resilience, establish innovations and new manufacturing techniques, expand the capability or performance ...
The post UKRI announces full list of 16 semiconductor projects getting government funding appeared first on Electronics Weekly.
Sony has expanded its LYTIA image sensor portfolio with a 50MP CIS designed for high-end and flagship smartphone cameras designated LYT-818. The device has a sensor size of 1/1.28″ and ...
The post Sony adds 50MP CIS appeared first on Electronics Weekly.
Melexis has expanded its Triaxis magnetic sensing IC range with stacked dual-die variants of the MLX90425 and MLX90426. Featuring a 5 mT stray field immunity (SFI) and 360° rotary detection ...
The post Melexis expands Triaxis magnetic sensing IC range appeared first on Electronics Weekly.
Samsung is releasing a new range of MLCCs (multi-layer ceramic capacitors) aimed at the electric vehicle (EV) industry, meeting demand for high rated voltage systems. Specifically, Samsung Electro-Mechanics is releasing ...
The post Samsung MLCCs target high-voltage demands of EV industry appeared first on Electronics Weekly.
