OULU, Finland—JOT Automation Inc. and EID Robotics have introduced a system of standardized, modular, robotic cells that can be combined to create microfactories for localized automated manufacturing of products.
24Gbit/s UCIe chiplet-to-chiplet IP demonstrated at 3nm
Alphawave Semi has unveiled 3nm UCIe (universal chiplet interconnect express) die-to-die communication intellectual property, which has been demonstrated with TSMC’s chip-on-wafer-on-substrate (CoWoS) packaging. “This complete PHY and controller subsystem, developed ...
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GaN LEDs and power transistors on the same chip
Gallium nitride-based LEDs and power transistors can be made on the same IC, according to scientists from Cornell University and the Polish Academy of Sciences. The trick is to used ...
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ASIL B EV battery current sensor spans ±1,500A
LEM is aiming at electric vehicle state-of-charge estimation with a ±1.5kA current sensor. Designed to be built into the ‘battery disconnect unit’, the HSTBV series can “reach 1% of accuracy ...
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Equal1 signs MoU with Nvidia for quantum computing tech
Irish quantum computing startup, Equal1 has signed a MoU with Nvidia to collaborate on quantum computing technology use cases, business models and proof of concept, focusing on integrating and validating ...
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Korean inventory falling faster
August chip inventories in Korea fell at the fastest rate for five years thanks to the demand for memory, reports Statistics Korea. Inventories were down 42.6% y-o-y. In July they ...
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12Mpixel AI image sensor from Raspberry Pi
Raspberry Pi has announced a 12.3Mpixel AI camera, based on Sony’s IMX500 intelligent sensor, which “supports on-board processing for a variety of neural network models, leaving the processor in the ...
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MoD buys Newton Aycliffe fab
The MoD has bought the old Fujitsu fab at Newton Aycliffe to make GaAs ICs for the military paying a reported £20 million. It will be renamed Octric Semiconductors UK. ...
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Hynix in mass production of 12-layer 36GB HBM
Hynix has begun mass production of a 36GB 12-layer HBM3E memory – the largest capacity HBM yet. The previous highest capacity HBM3E was 24GB using eight stacked 3GB die. ‘Hynix ...
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Fab equipment spend to reach $99.3bn this year
300mm fab equipment spending is projected to grow by 4% to $99.3 billion in 2024, and further increase by 24% to $123.2 billion in 2025, surpassing the US$100 billion level ...
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