UK chip design house Sondrel has appointed John Chubb as its CEO. A chartered engineer and a former Royal Naval Commander, he has over 30 years’ board level experience at ...
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The US government has warned officials in the Netherlands and Japan that it may impose its Foreign Direct Product Rule (FDPR) on suppliers of chip-manufacturing equipment if they don’t further ...
The post US may employ FDPR to plug tech leak to China appeared first on Electronics Weekly.
NXP’s digital car-key has been certified by the Car Connectivity Consortium (CCC) under its Digital Key Certification Programme. The key contains a single-chip NFC and embedded secure element designated SN220. ...
The post NXP’s digital car-key gets CCC cerification. appeared first on Electronics Weekly.
When monolithic scaling grew tremendously expensive for a minimal performance advantage, the idea emerged of dividing the SoC into chiplets and linking them together to build a system for specific ...
The post Chiplets, by imec appeared first on Electronics Weekly.
Jaxa is teaming with a Japanese company, iQPS, for on-orbit demonstrations that will estimate satellite orbital positions in real-time to centimeter-level accuracy. The Japanese space agency, has announced the joint ...
The post Jaxa teams with iQPS for on-orbit centimeter-level PPP demo appeared first on Electronics Weekly.
EC-1015HP epoxy potting compound provides significantly better crack resistance than traditional rigid epoxies.
Taiwan Semiconductor has introduced ten AEC-Q101-qualified small-signal mosfets. There are seven n-channel parts (including two duals), and three p-channel parts (one dual) in the ‘TQM’ line – see the table ...
The post Small-signal automotive mosfets appeared first on Electronics Weekly.
Snap-off development boards are not a new idea, but they are new at Mikroe, where the idea has been combined with the company’s Click format to form Click Snap. “Users ...
The post Click boards get snap-off sensors for stage-two prototyping appeared first on Electronics Weekly.
GlobalWafers and its subsidiary MEMC are to get $400 million in subsidies from the US Chips Act to build a 300mm silicon wafer manufacturing facility in Sherman, Texas and build ...
The post GlobalWafers gets $400m Chips Act subsidy appeared first on Electronics Weekly.
The Synergy of Infineon’s Power CoolMOS, CoolGaN, and CoolSiC Series with YMIN Capacitors’ Technology! In June 2024, Infineon recently launched a series of new products, including the 600 V CoolMOS™ ...
The post Sponsored Content: High-Efficiency Innovation in Power Systems! appeared first on Electronics Weekly.
