Bright fast phosphorescence is possible without heavy metal ions such as platinum or iridium, according to a team at Osaka University. Its researchers came across a molecule, thienyl diketone, which ...
The post Metal-free phosphor shows promise for OLEDs appeared first on Electronics Weekly.
Würth Elektronik has created a range of opto-isilated triacs for controlling light AC loads and larger triacs. They are called WL-OCTR, and come in a choice of packages: through hole ...
The post Wurth gets into opto-triacs appeared first on Electronics Weekly.
Vishay has introduced a series of surface-mount solid moulded tantalum chip capacitors specifically for electronic detonation systems “combining a robust mechanical design with low leakage current and stringent testing specifications”, ...
The post Low-leakage tantalum capacitors for detonating explosives appeared first on Electronics Weekly.
Rogue Valley Microdevices, the Oregon pure-play MEMS foundry, has won $6.7 million in Chips Act funding to help towards construction at its 300mm Florida fab site. RVM’s second fab, a ...
The post Rogue Valley MEMS fab gets $6.7m Chips Act funds appeared first on Electronics Weekly.
Researchers at at JILA, a joint institution of the US National Institute of Standards and Technology (NIST) and the University of Colorado Boulder have developed an atomic clock that can ...
The post Clock detects effects of gravity predicted by Einstein’s theory of relativity appeared first on Electronics Weekly.
The Munich-based satellite launch service company Isar Aerospace has extended its Series C funding round by €65m – it now totals €220m ($230m) – with backing from the NATO Innovation ...
The post NATO Innovation Fund backs Isar Aerospace in extended Series C appeared first on Electronics Weekly.
The CMOS Image Sensor ((CIS) market is projected by Yole Group to grow from $21.8 billion in 2023 to $28.6 billion in 2029, a 4.7% CAGR 23-29. Sony is advancing ...
The post Sony moves towards 50% CIS market share appeared first on Electronics Weekly.
