Three exciting new categories in Electronics Weekly’s Elektra Awards 2024 highlight the changing landscape of electronics. Reflecting changes in the electronics industry, this year there will be the Best Workplace ...
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TSMC will break ground on its first European fab in August, reports the Nikkei, with TSMC chairman and CEO C.CWei attending, “TSMC plans to hold the groundbreaking ceremony for the ...
The post TSMC to break ground on Dresden fab in August appeared first on Electronics Weekly.
Teledyne e2v Space Imaging is collaborating with Starris Optima Space Systems to develop space cameras for small satellites and lunar ecosystems. “Our joint development of these compact camera payloads begins ...
The post Teledyne e2v hooks up with Starris Optima on cameras for small satellites appeared first on Electronics Weekly.
Binder is adding an M8 12-pin circular connector to its industrial portfolio. Featuring 12 pins on the compact M8 connector face, the connectors are aimed at projects requiring miniaturisation. Applications ...
The post Binder eyes miniaturisation for M8 12-pin circular connector appeared first on Electronics Weekly.
Molex has brought out its Percept Current Sensors to provide busbar current sensors in industrial and automotive applications. The sensors combine Infineon’s coreless current sensors and Molex’s electronics packaging to reduce ...
The post Molex and Infineon hook up on coreless sensors appeared first on Electronics Weekly.
CUI Devices has added tweeters to its range of loudspeakers. Called the CTW range, there are six tweeters, measuring from 30.5 x 30.5mm to 58.8 x 58.8 mm, and between ...
The post CUI gets into tweeters appeared first on Electronics Weekly.
Microchip Technology has announced a 32bit 200MHz version of its dsPIC33 series of DSP-heavy MCUs. dsPIC33A, as the family will be called, is aimed at fast closed-loop control of PSUs ...
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Alphawave Semi claims to have delivered the first 3nm successful silicon bring-up of UCIe Die-to-Die (D2D) IP with TSMC’s CoWoS advanced packaging technology. The complete PHY and Controller subsystem was ...
The post Alphawave Semi first to 3nm UCIe D2D IP silicon bring-up appeared first on Electronics Weekly.
RAAAM Memory Technologies, a three year-old Israeli memory startup, has been awarded €5.25 million from the European Investment Council (EIC) to pursue an embedded memory technology it calls Gain-Cell RAM ...
The post RAAAM awarded €5.5m by EIC to develop SRAM alternative appeared first on Electronics Weekly.
The advanced packaging (AP) market is expected to have a CAGR23-29 of 11% to reach $69.5 billion in 2029, says Yole Group. The AP supply chain is undergoing significant transformation, ...
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