Arm CEO Renee Haas has told Reuters that Arm could have a 50% share of the Windows PC market by 2029. “Arm’s market share in Windows – I think, truly, ...
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Foldable phones have 1.5% of market
Foldable phones are expected to take 1.5% of the 2024 smartphone market with 17.8 million units, says TrendForce. Samsung had over 80% of the market share in 2022 but, with ...
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Leicester University, ispace work on lunar night survival technology
The University of Leicester is working with ispace, the Japanese space transportation specialist, to develop lunar night survival technology. They will collaborate on different approaches that could benefit future ispace ...
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Asashi Kasei Micro and Silicon Austria validate eFuse in 800V SiC-based auto applications
Asahi Kasei Microdevices (AKM) and Silicon Austria Labs (SAL), have conducted a joint proof of concept for eFuse technology in high-voltage applications using SiC-based power devices. The results show that ...
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Thermoelectric coolers include heatsinks and fans
Laird Thermal Systems has created a range of thermoelectric coolers for taking heat out of small spaces, such as the chambers within medical analysers or test instruments. The SuperCool X ...
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ICFUST: Far-UVC LED for killing germs
Silanna UV will launch a 235nm LED at ICFUST 2024, the International Congress on Far-UVC Science and Technology. SF1-3M1FWL1 is a 700mW input (30mA, 23.5V nominal) device that typically emits ...
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Universal input ac-dc DIN rail PSUs up to 480W
Recom has launched a series of DIN-rail ac-dc power supplies with 90 to 264Vac inputs and 120W, 240W or 480W outputs – and it has some new mini buck dc-dc ...
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Computex 2024: CXL memory expansion server to advance AI and HPC
Servers based on the 4th Gen AMD EPYC processors have been introduced at Computex 2024 by MSI. The servers also feature CXL (Compute Express Link) technology and DC-MHS architecture, for ...
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PCIM: 650V SiC mosfets in 8x8mm TOLL and top-side cooled packaging
Infineon is putting 650V silicon carbide mosfet die into two packages with SO-type footprints: a thin (1.5mm) bottom-cooled 8 x 8mm leadless TO (TOLL – TO leadless), and 9.8 x ...
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PCIM: 650V SiC mosfets in 8x8mm TOLL and top-side cooled packaging
Infineon is putting 650V silicon carbide mosfet die into two packages with SO-type footprints: a thin (1.5mm) bottom-cooled 8 x 8mm leadless TO (TOLL – TO leadless), and 9.8 x ...
The post PCIM: 650V SiC mosfets in 8x8mm TOLL and top-side cooled packaging appeared first on Electronics Weekly.