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NXP and Vanguard to build fab in Singapore

June 5, 2024
david manners

Vanguard International Semiconductor Corp, the Taiwan foundry,  and NXP are to create a manufacturing jv called VisionPower Semiconductor Manufacturing Company Pte Ltd (“VSMC”) which will build a new 300mm semiconductor ...

The post NXP and Vanguard to build fab in Singapore appeared first on Electronics Weekly.

Bloomberg looking for UK’s smartest startups

June 5, 2024
david manners

‘We’re looking for the smartest ideas and founders from all over the UK to join this year’s list, says Bloomberg, ‘we believe that diversity — of founders, of workers, of ...

The post Bloomberg looking for UK’s smartest startups appeared first on Electronics Weekly.

Intel sells 49% of Irish Fab 34 to Apollo

June 5, 2024
david manners

Intel has sold 49% of its Fab 34 in Leixlip, Ireland for $11 billion to  private equity fund Apollo. It is  Intel’s second Semiconductor Co-Investment Program (SCIP) arrangement. SCIP is ...

The post Intel sells 49% of Irish Fab 34 to Apollo appeared first on Electronics Weekly.

Rapidus and IBM hook up on chiplet packaging

June 5, 2024
david manners

Rapidus, the Japanese startup developing a 2nm manufacturing process, and IBM are to IBM), establish mass production technologies for chiplet packaging Rapidus will receive packaging technology from IBM for high-performance ...

The post Rapidus and IBM hook up on chiplet packaging appeared first on Electronics Weekly.

Slow take-up for AI

June 5, 2024
david manners

An Oxford University/Reuters Institute survey of 12,000 people in Argentina, Denmark, France, Japan, the UK, and the USA found that ChatGPT is by far the most widely recognised generative AI ...

The post Slow take-up for AI appeared first on Electronics Weekly.

JEDEC JEP30 specs Part Model Guidelines for Chiplet Integration

June 5, 2024
Alun Williams

JEDEC has published a new release of the JEP30 Part Model Guidelines, including reference documents and related XML Schema files. Working in collaboration with the Open Compute Project Foundation (OCP), ...

The post JEDEC JEP30 specs Part Model Guidelines for Chiplet Integration appeared first on Electronics Weekly.

Raspberry Pi turns to Halio for 13Top/s AI acceleration

June 4, 2024
steve bush

  Raspberry Pi 5 now has the option of an AI co-processor for neural networks, artificial intelligence and machine learning. The AI kit comprises the same M.2 HAT+ recently announced ...

The post Raspberry Pi turns to Halio for 13Top/s AI acceleration appeared first on Electronics Weekly.

U-blox offers Bluetooth AoA in Omlox real-time location system

June 4, 2024
steve bush

U-blox has created an omlox-compatible indoor asset tracking system based on Bluetooth LE Angle-of-Arrival technology. Branded ‘u-locate’, “it offers every necessary hardware, software and middleware component for indoor positioning, including ...

The post U-blox offers Bluetooth AoA in Omlox real-time location system appeared first on Electronics Weekly.

Intel announces Lunar Lake architecture for ‘thin and light’ PCs

June 4, 2024
Caroline Hayes

At Computex 2024, Intel has revealed details of its Lunar Lake architecture for AI PC processors. It has been designed for power efficiency compute performance in ‘thin and light’ PC ...

The post Intel announces Lunar Lake architecture for ‘thin and light’ PCs appeared first on Electronics Weekly.

Intel brings out Xeon 6; declares accelerator price war with Nvidia

June 4, 2024
david manners

Intel has launched its Xeon 6 server processors which have an efficiency model and a performance model. The 144 core efficiency model is claimed to use 67% fewer server racks ...

The post Intel brings out Xeon 6; declares accelerator price war with Nvidia appeared first on Electronics Weekly.

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