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Thermoelectric coolers include heatsinks and fans

June 3, 2024
steve bush

Laird Thermal Systems has created a range of thermoelectric coolers for taking heat out of small spaces, such as the chambers within medical analysers or test instruments. The SuperCool X ...

The post Thermoelectric coolers include heatsinks and fans appeared first on Electronics Weekly.

ICFUST: Far-UVC LED for killing germs

June 3, 2024
steve bush

Silanna UV will launch a 235nm LED at ICFUST 2024, the International Congress on Far-UVC Science and Technology. SF1-3M1FWL1 is a 700mW input (30mA, 23.5V nominal) device that typically emits ...

The post ICFUST: Far-UVC LED for killing germs appeared first on Electronics Weekly.

Universal input ac-dc DIN rail PSUs up to 480W

June 3, 2024
steve bush

Recom has launched a series of DIN-rail ac-dc power supplies with 90 to 264Vac inputs and 120W, 240W or 480W outputs – and it has some new mini buck dc-dc ...

The post Universal input ac-dc DIN rail PSUs up to 480W appeared first on Electronics Weekly.

Computex 2024: CXL memory expansion server to advance AI and HPC

June 3, 2024
Caroline Hayes

Servers based on the 4th Gen AMD EPYC processors have been introduced at Computex 2024 by MSI. The servers also feature CXL (Compute Express Link) technology and DC-MHS architecture, for ...

The post Computex 2024: CXL memory expansion server to advance AI and HPC appeared first on Electronics Weekly.

PCIM: 650V SiC mosfets in 8x8mm TOLL and top-side cooled packaging

June 3, 2024
steve bush

Infineon is putting 650V silicon carbide mosfet die into two packages with SO-type footprints: a thin (1.5mm) bottom-cooled 8 x 8mm leadless TO (TOLL – TO leadless), and 9.8 x ...

The post PCIM: 650V SiC mosfets in 8x8mm TOLL and top-side cooled packaging appeared first on Electronics Weekly.

PCIM: 650V SiC mosfets in 8x8mm TOLL and top-side cooled packaging

June 3, 2024
steve bush

Infineon is putting 650V silicon carbide mosfet die into two packages with SO-type footprints: a thin (1.5mm) bottom-cooled 8 x 8mm leadless TO (TOLL – TO leadless), and 9.8 x ...

The post PCIM: 650V SiC mosfets in 8x8mm TOLL and top-side cooled packaging appeared first on Electronics Weekly.

AMD to match Nvidia’s one year cadence for AI IC introductions

June 3, 2024
david manners

Earlier today, AMD CEO Lisa Su said AMD would match the one year cadence for new AI processors set yesterday by Jensen Huang, CEO of Nvidia. AMD’s  next AI chip ...

The post AMD to match Nvidia’s one year cadence for AI IC introductions appeared first on Electronics Weekly.

Nvidia enabling AI factories

June 3, 2024
david manners

Nvidia will bring out  a new family of AI chips every year, says CEO Jensen Huang. The next one, called Rubin, containing networking  ICs, a GPU and a CPU (called ...

The post Nvidia enabling AI factories appeared first on Electronics Weekly.

Great Wall closes European office

June 3, 2024
david manners

Great Wall Motor, the Chinese EV maker, is to close its European HQ in Munich and lay off all 100 employees after poor European sales, reports the Nikkei. Plans to ...

The post Great Wall closes European office appeared first on Electronics Weekly.

US government sets up semiconductor digital twin initiative

June 3, 2024
david manners

The US government has issued a Notice of Funding Opportunity (NOFO) seeking proposals from eligible applicants for activities to establish and operate a CHIPS Manufacturing USA institute focused on digital ...

The post US government sets up semiconductor digital twin initiative appeared first on Electronics Weekly.

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