CUI Devices has added 300 parts to its line of power relays. “This product introduction more than doubled our previous offering,” a spokesman for the company told Electronics Weekly. “The ...
The post CUI doubles power relay range appeared first on Electronics Weekly.
EMI Solutions has introduced three-phase single-stage chassis-mount mains EMI filters aimed at common mode and differential mode suppression. Called the MF423-3W series, they come in four footprints: 1-10A: 85 x ...
The post Three-phase EMC filters from 1 to 150A appeared first on Electronics Weekly.
At ECTC, French research lab CEA-Leti has reported stacking three 300mm wafers for improved CMOS image sensors, using hybrid wafer bonding and high-density through-silicon vias. It is working towards a ...
The post ECTC: Triple wafer stacking for image sensors with embedded AI appeared first on Electronics Weekly.
ST is to get €2 billion from the Italian government under the auspices of the EU Chips Act to support construction of its $5.4 billion manufacturing site in Catania, Sicily, ...
The post ST gets €2bn grant for $5.4bn Catania SiC site appeared first on Electronics Weekly.
TDK has introduced a radio wave absorber material with more than 25% or biomass by weight. Called the IS-BP series, the foams are intended to line the ceiling, walls and ...
The post RF absorber has 25% biomass appeared first on Electronics Weekly.
Alpha and Omega Semiconductor is aiming at Meteor Lake and Arrow Lake notebooks with a multi-phase dc-dc converter controller that meets Intel IMVP 8, 9, 9.1, and 9.2 specifications. AOZ71137QI ...
The post Three rail multi-phase dc-dc controller meets Intel IMVP 9.2 appeared first on Electronics Weekly.
Binder is expanding its M12 range to include panel mount connectors with a continuous M12x1 mounting thread now equipped with assembled wires. In addition to the previously offered dip-soldered versions, ...
The post M12 panel mount connectors with assembled wires appeared first on Electronics Weekly.
Epishine, the Swedish indoor solar cell specialist, has raised £5 million in a private placement led by Pareto Securities. The funding enables Epishine to accelerate the commercial expansion of its ...
The post Epishine raises £5m appeared first on Electronics Weekly.
Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
The post Imec develops die-to-wafer bond process with 2µm pad pitch appeared first on Electronics Weekly.
Q1 saw NAND revenues rise by 28.1% to $14.71 billion, says TrendForce. Micron overtook Western Digital to claim the fourth spot with 51.2% QoQ revenue growth to $1.72 billion. Samsung ...
The post NAND revenues rising; Q2 prices to grow 10% appeared first on Electronics Weekly.
