Professor Mike Capaldi, dean of innovation and business at Newcastle University, is to be the Chair of UK power, electronics, machines and drives (PEMD) manufacturing network DER-IC. Funded by Innovate ...
The post Capaldi is chair of UK power electronics network appeared first on Electronics Weekly.
u-blox has announced four stamp-sized wireless MCU modules that can run user code and support Bluetooth LE 5.4, Thread, Matter and PSA Certified Level 3 security. ALMA-B10x versions are built ...
The post Wireless MCU modules cover Bluetooth LE 5.4, Thread and Matter appeared first on Electronics Weekly.
sureCore, the low power embedded SRAM IP specialist, has announced the availability of its PowerMiser, ultra-low, dynamic power memory compiler in 16nm. This will enable developers to more easily hit ...
The post sureCore moves SRAM cores to 16nm finfet process appeared first on Electronics Weekly.
Hynix is to build a $3.9 billion HBM packaging plant at the Purdue Research Park in West Lafayette, Indiana. Production is due to start in H2 2028. “We are excited ...
The post Hynix to build $3.9bn HBM packaging plant in Indiana appeared first on Electronics Weekly.
X-FAB Silicon Foundries, the analogue/mixed-signal and specialty foundry, has added a back-side illumination (BSI) capability p to its XS018 180nm CMOS semiconductor process used for optical sensors Through BSI, imaging ...
The post X-Fab adds BSI to optical sensor process appeared first on Electronics Weekly.
The U.S. and UK have signed an MoU which will see them work together to develop tests for the most advanced AI models, following through on commitments made at the ...
The post US and UK sign AI safety MoU appeared first on Electronics Weekly.
The UK Government has launched the first funding call for its C-LEO programme – to help boost the country’s satellite communications sector – which was announced in the recent Spring ...
The post First funding call for C-LEO programme for satellite communications appeared first on Electronics Weekly.
Red Semiconductor has announced RISC-V instruction set extensions, and a hardware design, for edge AI and cryptography in asics and FPGAs. The hardware, called ‘VISC’, is an accelerated RISC-V core ...
The post Accelerated RISC-V core optimised edge AI and cryptography appeared first on Electronics Weekly.
NXP Semiconductors has announced hardware secure element certified to FIPS 140-3 Level 3. “SE052F combines the flexibility of a secure element with the newest generation of the Federal Information Processing ...
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Automotive connectors play a crucial role in the circuitry of vehicles, as their dependability directly affects the overall functioning of the vehicle system. As the demands for automotive safety, environmental ...
The post Sponsored Content: Driving the Future: Evolution of Automotive Connectors appeared first on Electronics Weekly.
