In a post on Linkedin, Graham Curren (pictured) writes: “After nearly 23 years leading Sondrel I’m pleased tell you that I am handing over the role of CEO to David ...
The post Curren steps down as CEO of Sondrel appeared first on Electronics Weekly.
TDK has put an mems piezoelectric ultrasonic time-of-flight distance sensor inside a 3.5 x 3.5mm package along with its signal chain. “ICU-10201 offers the sensitivity required for obstacle avoidance or ...
The post Ultrasonic time-of-flight IC includes transducer and processing appeared first on Electronics Weekly.
TSMC has been awarded $6.6 billion of Chips Act moneys and has increased its US investment from $40 billion to $65 billion. TSMC is to build a third fab in ...
The post TSMC gets $11.6bn funding and ups US spend to $65bn appeared first on Electronics Weekly.
NXP has finally revealed the wireless versions of its MCX microcontrollers, first announced in mid-2022. “Featuring the industry’s first MCU with Bluetooth Channel Sounding, NXP’s MCX W series enables edge ...
The post NXP reveals MCX MCUs with Matter, Thread, Zigbee and Bluetooth LE appeared first on Electronics Weekly.
Next week (April 15th) Samsung is expected to announce it will build a second fab in Taylor, Texas plus funding for additional R&D and packaging facilities to bring its total ...
The post Samsung to double Taylor investment appeared first on Electronics Weekly.
Mouser is partnering with Edge Impulse, a development platform that enables ML on edge devices, providing advanced intelligence to a wide range of products and devices, from low-power MCUs to ...
The post Mouser hooks up with Edge Impulse for edge ML appeared first on Electronics Weekly.
Murata is sampling its Type 2GT module, a multi-band, low-power radio (LoRa) module which measures 9.98 x 8.70 x 1.74mm and is built on a PCB housed in a metal ...
The post Murata sampling multi-band LoRa module appeared first on Electronics Weekly.
