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Wireless MCU for Bluetooth 5.3 LE in chip-scale package

November 7, 2023
steve bush

ST has announced a wireless microcontroller with the Bluetooth 5.3 LE software, initially in a 5 x 5mm QFN, and scheduled to be available in a ~2.8 x 3mm chip-scale ...

The post Wireless MCU for Bluetooth 5.3 LE in chip-scale package appeared first on Electronics Weekly.

Cortex-M55 MCU gets neural network accelerator for AI-at-the-edge

November 7, 2023
steve bush

Infineon has announced a family microcontrollers combining an Arm Cortex-M55 core (including ‘Helium’ DSP support), an Arm Ethos-U55 machine learning processor, and an Arm Cortex-M33 core, which has in-built security, ...

The post Cortex-M55 MCU gets neural network accelerator for AI-at-the-edge appeared first on Electronics Weekly.

Through-hole three-phase 600V brushless motor drives

November 7, 2023
steve bush

Toshiba is aiming at pumps, air conditioning and fans with through-hole versions of its latest 600V three-phase brushless dc motor drivers. TPD4163K and TPD4164K come in a 32.8 x 13.5 ...

The post Through-hole three-phase 600V brushless motor drives appeared first on Electronics Weekly.

Call for EU PIC subsidies

November 7, 2023
david manners

CEOs from eight of Europe’s largest integrated photonics companies have presented a plan to EU officials for building a European supply chain for photonic integrated circuits. The eight CEOs are: ...

The post Call for EU PIC subsidies appeared first on Electronics Weekly.

2023 UK venture deals had more US investor participation than any other country

November 7, 2023
david manners

In 2023, the UK had more venture deals with US investors involved than any other country, says Pitch Book. US investors participated in 526 UK deals during the year. In ...

The post 2023 UK venture deals had more US investor participation than any other country appeared first on Electronics Weekly.

TI breaks ground on Utah fab

November 7, 2023
david manners

TI  has broken ground on a 300-mm fab in Lehi, Utah. Joined by Utah Governor Spencer Cox, TI CEO Haviv Ilan took the first steps toward construction of LFAB2 which ...

The post TI breaks ground on Utah fab appeared first on Electronics Weekly.

Cadence offers academia PDK for open source 130nm SkyWater process

November 7, 2023
david manners

A PDK for the SkyWater open-source 130 nm process will be available in the Cadence VLSI (very large-scale integration) Fundamentals Education Kit. The kit teaches students how theories and concepts ...

The post Cadence offers academia PDK for open source 130nm SkyWater process appeared first on Electronics Weekly.

DigiKey partners with Ambiq, expands line card by 40K products

November 7, 2023
Alun Williams

DigiKey has announced is partnering with Ambiq, a specialist in “ultra-low” power ICs, for global distribution. Through the agreement, for example, DigiKey is now stocking Ambiq’s Apollo4 Blue Plus SoC, ...

The post DigiKey partners with Ambiq, expands line card by 40K products appeared first on Electronics Weekly.

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