German factory automation company Sick has introduced 3d inspection cameras that can measure down to 800nm. Called Ruler3002, 3004, 3010, the cameras work with fields of view down to 26.6mm. ...
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IBM has revealed an analogue in-memory IC for implementing neural networks. The device stores weights locally as analogue levels as conductance in phase-change memory, and implements analogue multiply-accumulate calculation. For ...
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Hynix was showing off a sample of its 321-layer 1Tb TLC NAND chips at The Flash Memory Summit earlier this week, though volume production isn’t due until 2025. Hynix used a CMOS under Array (CuA) technology which involves moving the peripheral circuitry under the cells. The company calls its peri under cell (PUC) technology ‘4D ...
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At a board meeting earlier this week, TSMC allocated $6 billion for building leading edge capacity in Taiwan. Some of the money will go towards TSMC’s second site for 2nm production which is under construction in Kaohsiung. The company’s initial volume production on the 2nm process will be in Hsinchu starting in 2025, with the first ...
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Demand for HBM bits will double by 2024, says TrendForce, but the supply and implementation of TSV equipment required for the expansion will delay most of the required increase in capacity nuntil Q2 2024. The 2022+HBM market had sufficient supply. However, an explosive surge in AI demand in 2023 has prompted clients to place advance ...
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Leaf Space has raised capital for a total of €20 million ($22 million) on top of a loan by the European Investment Bank (EIB) for a further €15 million through Venture Debt. The company, which specialises in ground segment services for satellite operators, said the funding would help it expand its global network of ground ...
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