New Yorker Electronics is to be a franchises distributor for Degson. “Founded in 1990, Degson is one of the largest manufacturers of terminal blocks and precision moulds in Asia – it currently produces more than one billion terminal blocks a year and sells to 90 countries,” according to the New Jersey-based distributor. “For New Yorker, ...
The post New Yorker signs Degson for connectors and manufacturing services appeared first on Electronics Weekly.
Panasonic has announced a demo kit for Wirepas mesh networking, builts around its PAN1780 Bluetooth 5 LE module, with has a Nordic Semi’s nRF52840 radio IC and an antenna. IoT software company Symbiotech, which already has Wirepas Mesh products, has provided the kit’s software, and Panasonic earlier teamed up with Wirepas to get the mesh ...
The post Wirepas demo kit for mesh networking appeared first on Electronics Weekly.
India is once again pitching for semiconductor investment after a string of prospective projects have fallen through. “India is becoming an excellent conductor for semiconductor investments,” said prime minister Narendra Modi (pictured) at the weekend, “the world needs a reliable supply chain. Who can be a more trusted partner than the world’s largest de Modi was ...
The post Modi pitching for chip investment appeared first on Electronics Weekly.
Huawei plans to fab 5G chips on a 7nm process at SMIC this year, reports the Nikkei. The chips are not expected to be in phones on the market until next year. Last year, SMIC used a 7nm process to fab a cryptocurrency mining chip for Bitmain Technologies. The 7nm process Huawei is using is ...
The post Huawei planning on using SMIC to fab 7nm ICs this year appeared first on Electronics Weekly.
Micron has begun sampling an 8-high 24GB HBM3 Gen2 memory with bandwidth greater than 1.2TB/s and pin speed over 9.2Gb/s. It is built on Micron’s 1β (1-beta) DRAM process node, which allows a 24Gb DRAM die to be assembled into an 8-high cube within an industry-standard package dimension. A 12-high stack with 36GB capacity ...
The post 24GB HBM3 memory appeared first on Electronics Weekly.
The robotic patents war is not over but disputes don’t have to reach court, writes Alexander Ford of Withers & Rogers, in the wake of the Ocado and AutoStore settlement. Following a three-year-long legal dispute over alleged patent infringement, Ocado and Norwegian robotic tech company, AutoStore, have reached an out-of-court settlement. But the robot patent ...
The post Viewpoint: Peace breaks out in robotic patents war? appeared first on Electronics Weekly.
SolidRun is aiming at artificial intelligence with a fanless industrial computer that combines an octa-core AMD Ryzen 7840HS processor and three of Hailo’s Hailo-8 AI accelerators, each rated at 26Top/s. “An important feature of Hailo-8 AI accelerator and Hailo AI software suite is linear scaling of the inference performance simply by adding modules,” said Hailo ...
The post Fanless AI PC can hit 78Top/s appeared first on Electronics Weekly.
Infineon Technologies is testing a biodegradable PCB material based on natural fibres in demo and evaluation boards. The substrate, branded Soluboard, is from UK start-up Jiva Materials, which claims that it would result in a 60% reduction in carbon emissions compared with FR-4, saving 10.5kg of carbon and 620g of plastic per square meter of PCB. ...
The post Infineon tries recyclable PCBs for demo and eval boards appeared first on Electronics Weekly.
Harwin has created a range of retro-fittable 360° anti-interference back-shells for its Kona high-power connector series. “These back-shells will prevent unwanted EMI leaking out from the connector-cable assembly into the surrounding system,” according to the company. “The two-part construction of the Kona backshells enables engineers to up-grade their existing cable assemblies with 360° EMC shielding.” ...
The post EMI back-shells for Harwin mini power connector appeared first on Electronics Weekly.
Intel’s Q2 revenue fell 15% to $12.9 billion from $15.3 billion a year ago, marking the sixth consecutive quarter of declining sales. Profit was $1.5 billion compared to a loss of $454 million in Q2 2022. It expects revenue of $13.4 billion in Q3. Intel CEO Pat Gelsinger (pictured) expects “persistent weakness” in all segments ...
The post Intel returns to profitability appeared first on Electronics Weekly.
