The advanced packaging market is expected to grow at 6.6% CAGR 2019-2025, reaching $42 billion in 2025, forecasts Yole Developpement. By technology platform: the highest revenue CAGR is expected from 2.5D / 3D stacking IC , embedded die, and fan-out representing 21%, 18% and 16% of the total market, respectively. TSMC, Intel, Samsung, Amkor, ASE ...

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